Cooling of Electronic Equipment Utilizing Nanofluids in Minichannel Mounted over a Heat Pipe

Jump To References Section

Authors

  • Sonal Kumar
     Department of Aerospace Engineering and Applied Mechanics, IIEST Shibpur, Howrah-711103 ,IN
  • Pabitra Halder
     Department of Aerospace Engineering and Applied Mechanics, IIEST Shibpur, Howrah-711103 ,IN

DOI:

https://doi.org/10.24906/isc/2020/v34/i4/205480

Keywords:

Heat pipe, Minichannel, Nanofluid, Electronic Cooling, Two Phase Heat Transfer.

Abstract

Modern day microprocessor has increased remarkably in computational capacity which in turn has resulted in generation of higher heat fluxes. Air based conventional heat extraction systems are bungling to eradicate the aforesaid heat fluxes as the need of information technology and high computational facility is skyrocketing. In this present study, numerical simulation is carried out to analyze and compare the thermal performance of a heat pipe combined with forced convection heat transfer mechanism utilizing nanofluids in a minichannel heat sink for application in CPU cooling. Two phase heat transfer phenomenon employed in heat pipe can accomplish extreme heat removal rate. Temperature gradient along with thermal resistance between the coolant and minichannel heated wall is significantly reduced due to the application of nanofluids. Convective heat transfer coefficient at the condenser end of the heat pipe is noticeably improved with application of nanoparticles into distilled water.

Downloads

Download data is not yet available.

Downloads

Published

2020-07-01

How to Cite

Kumar, S., & Halder, P. (2020). Cooling of Electronic Equipment Utilizing Nanofluids in Minichannel Mounted over a Heat Pipe. Indian Science Cruiser, 34(4), 32–36. https://doi.org/10.24906/isc/2020/v34/i4/205480

Issue

Volume 34, Issue 4, July 2020

Section

Search & Survey
Crossref
Scopus
Google Scholar
Europe PMC

 

References

S CFok, W Shen, F L Tan, Cooling of portable hand-held electronic devices using phase change materials in finned heat sinks, International Journal of Thermal Sciences, Vol49 page 109-117, 2009.

R Kandasamy, X Q Wang, A S Majumdar, Application of phase change materials in thermal management of electronics, Applied Thermal Engineering,Vol27, page 2522–2832, 2007.

R Kandasamy, X Q Wang, A S Majumdar, Transient cooling of electronics using phase change materials (PCM)-base heat sinks, Applied Thermal Engineering,Vol28,page 1047–1057, 2008.

J Krishna, P S Kishore, A B Solomon, Heat pipe with nano enhanced-PCM for electronic cooling application, Experimental Thermal and Fluid Science, Vol81 , page 84-92, 2017.

S W Chang, S F Chiou, S F Chang, Heat transfer of impinging jet array over concave-dimpled surface with applications to cooling of electronic chipsets, Experimental Thermal and Fluid Science, Vol31 (7) , page 625-640,2007.

J Kim, Spray cooling heat transfer: the state of the art, International Journal of Heat and Fluid Flow, Vol 28 (4), page 753-767,2007.

R Chein, G Huang, Thermoelectric cooler application in electronic cooling, Applied Thermal Engineering, Vol24 (14–15), page 2207-2217, 2004.

N Putra, Design manufacturing and testing of a portable vaccine carrier box employing thermoelectric module and heat pipe, Journal of Medical Engineering and Technology, Vol 33 (3), page 232-237,2009.

H S Huang, Y C Weng, Y W Chang, S L Chen, M T Ke, Thermoelectric water-cooling device applied to electronic equipment, International Communications in Heat and Mass Transfer, Vol 37 (2), page 140-146,2010.

P Naphon, S Wiriyasart, Liquid cooling in the mini-rectangular fin heat sink with and without thermoelectric for CPU, International Communications in Heat and Mass Transfer,Vol 36 (2), page 166-171, 2009.

tra, Ardiyansyah, W Sukyono, D Johansen, F Iskandar, The characterization of a cascade thermoelectric cooler in a cryosurgery device, Cryogenics, Vol 50 (11–12), page 759-764, 2010.

U S Choi, Enhancing thermal conductivity of fluids with nanoparticles, in: D.A. Siginer, H.P. Wang (Eds.), Developments and applications of nonNewtonian flows, FED-vol. 231/MD-vol. 66, ASME, New York, page 99–105,1995.

C T Nguyen, G Roy, C Gauthier, N Galanis, Heat transfer enhancement using Al2O3–water nanofluid for an electronic liquid cooling system, Applied Thermal Engineering, Vol 27 (8–9), page 1501-1506, 2007.

S P Jang, S U S Choi, Cooling performance of a microchannel heat sink with nanofluids, Applied Thermal Engineering, Vol 26 (17–18), page 24572463,2006.

K S Kim, M H Won, J Wkim, B J Back, Heat pipe cooling technology for PC desktop, Applied Thermal Engineering, Vol 23, page1137–1144, 2003.

D L Sun, J L Xu, L Wang, Development of a vaporliquid phase change model for volume-of-fluid method in Fluent, International Communication in Heat and Mass Transfer, Vol 39, page 11011106, 2012.

Y F Maydanik, S V Vershinin, M A Korukov, J M Ochterbeck, Miniature Loop Heat Pipes-A Promising Meansfor Cooling Electronic, IEEE transactions on components and packaging technologies, Vol 28, No. 2, June 2005.

Z J Zuo, M T North, K L Wert, High Heat Flux Heat Pipe Mechanism for Cooling of Electronics, IEEE transactions on components and packaging technologies, Vol 24, No. 2, June 2001.

Y W Chang, C H Cheng, J C Wang, S L Chen, Heat pipe for cooling of electronic equipment, Energy Conversion and Management, Vol 49 (11), page 3398-3404, 2008.

W H Lee, A pressure iteration scheme for two-phase flow modeling, Washington, USA: Hemisphere Publishing, page 37, 1980.

H C Brinkman, The viscosity of concentrated suspensions and solutions, Journal of Chemical Physics, Vol 20, page571–581, 1952.