Sensitivity Analysis of Micro-Structured Dielectric Layer of Capacitive Pressure Sensors for Flexible Electronics Applications

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Authors

  • S. Ananthi
     Department of Electronics and Communication Engineering, Manipal University Jaipur, Jaipur ,IN
  • Himanshu Chaudhary
     Department of Electronics and Communication Engineering, Manipal University Jaipur, Jaipur ,IN
  • Kulwant Singh
     FlexMEMS Research Centre, Department of Electronics and Communication Engineering, Manipal University Jaipur, Jaipur ,IN

DOI:

https://doi.org/10.18311/jmmf/2023/33931

Keywords:

Micro-Structure, Dielectric, Flexible, Performance, Simulation.

Abstract

Micro-structuring the surface of the dielectric medium that is sandwiched between the two electrodes of the capacitive pressure sensor (CPS), increases the sensitivity of the sensor compared to, without the microstructure. A thorough analysis of CPS output sensitivity, linearity and relative change in its capacitance are done by introducing micro-structure in the dielectric layer. The designed micro-pyramidal structure on the surface of PDMS dielectric layer shows good linearity over the simulated range of 0-50 k Pa and with a nonlinearity error of 1%. Different types of microstructures are designed and their performance is studied first. The simulated result also compared to dielectric layer without any micro-structure and with vacuum as dielectric layer. Further analysis done by selecting the micro-pyramidal structure and varying its base length and the inter space between the micro-structure. The designed model with surface area=400sq.µm and distance=20µm and pyramidal micro-structure gives 51.4 times increase in sensitivity when compared to the same model without any micro-structure.

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Published

2023-06-01

How to Cite

Ananthi, S., Chaudhary, H., & Singh, K. (2023). Sensitivity Analysis of Micro-Structured Dielectric Layer of Capacitive Pressure Sensors for Flexible Electronics Applications. Journal of Mines, Metals and Fuels, 71(4), 529–533. https://doi.org/10.18311/jmmf/2023/33931

Issue

Volume 71, Issue 4, April 2023

Section

Articles

License

Creative Commons License

This work is licensed under a Creative Commons Attribution-NonCommercial 4.0 International License.

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