Thermal Performance Analysis of Electronic Components on Different Substrate Materials

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Authors

  • Anant Sidhappa Kurhade
     Department of Mechanical Engineering, Dr. D. Y. Patil Institute of Technology, Pimpri, Pune - 411018, Maharashtra ,IN
  • Tushar Gadekar
     Department of Mechanical Engineering, Marathwada Mitramandal's College of Engineering, Karvenagar, Pune - 411052, Maharashtra ,IN
  • Gulab Dattrao Siraskar
     Department of Mechanical Engineering, PCET’s Pimpri Chinchwad College of Engineering and Research, Ravet, Pune - 412101, Maharashtra ,IN
  • Swapna Swapnil Jawalkar
     Department of Mechanical Engineering, Marathwada Mitramandal's College of Engineering, Karvenagar, Pune - 411052, Maharashtra ,IN
  • Ramdas Biradar
     School of Engineering and Technology, PCET’s Pimpri Chinchwad University, Sate, Pune - 412106, Maharashtra ,IN
  • Arjun Arun Kadam
     Department of Mechanical Engineering, Arvind Gavali College of Engineering, Satara, 415015, Maharashtra ,IN
  • Rahul Shivaji Yadav
     Department of Mechanical Engineering, Marathwada Mitramandal's College of Engineering, Karvenagar, Pune - 411052, Maharashtra ,IN
  • Sagar Arjun Dalvi
     Department of Mechanical Engineering, Abhinav Education Society's College of Engineering and Technology (Degree), Wadwadi, Satara - 412801, Maharashtra ,IN
  • Shital Yashwant Waware
     Department of Mechanical Engineering, Dr. D. Y. Patil Institute of Technology, Pimpri, Pune - 411018, Maharashtra ,IN
  • Chaitalee Naresh Mali
     Department of Chemistry, Dr. D. Y. Patil Institute of Technology, Pimpri, Pune - 411018, Maharashtra ,IN

DOI:

https://doi.org/10.18311/jmmf/2024/45569

Keywords:

IC Chips, Optimal Arrangement, SMPS Board, Thermal Management

Abstract

This study numerically analyzed different substrate board materials, including FR4, silicon, and copper, for electronic component cooling. Ten diverse components were mounted on these boards and subjected to uneven heat distribution. Both natural and forced air cooling were tested at various speeds. Copper cladding significantly lowered component temperatures by 34-54 degrees Celsius compared to FR4 or silicon at 7 m/s. Moreover, copper allowed for lower fan speeds (5 m/s) while keeping component temperatures below 100 degrees Celsius, reducing energy consumption. These results offer valuable guidance for thermal engineers in selecting optimal substrate boards for efficient electronic cooling.

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Published

2024-10-30

How to Cite

Kurhade, A. S., Gadekar, T., Siraskar, G. D., Jawalkar, S. S., Biradar, R., Kadam, A. A., Yadav, R. S., Dalvi, S. A., Waware, S. Y., & Mali, C. N. (2024). Thermal Performance Analysis of Electronic Components on Different Substrate Materials. Journal of Mines, Metals and Fuels, 72(10), 1093–1098. https://doi.org/10.18311/jmmf/2024/45569

Issue

Volume 72, Issue 10, October 2024

Section

Articles

License

Creative Commons License

This work is licensed under a Creative Commons Attribution-NonCommercial 4.0 International License.

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Europe PMC
Received 2024-08-27
Accepted 2024-09-03
Published 2024-10-30

 

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